temperature

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mexican

hi

we are running amd 2800, 512 mb, gigabyte MB

the system temp is around 34 C and cpu around 45 C and is on for most of the
day

the threshold temps are around 60 C

is this OK, as the fan is sometimes noisy and too quiet?
 
we are running amd 2800, 512 mb, gigabyte MB
the system temp is around 34 C and cpu around 45 C and is on for most of the
day
the threshold temps are around 60 C
is this OK, as the fan is sometimes noisy and too quiet?

Get Everest and take a close look at what's going on inside.

I have a Celeron D 2.4 GHz CPU with Intel-supplied heat sink/fan
(so-called "retail box") on a MCI mainboard using the Intel chipset.
My CPU runs at 35C when idle and at most 45C when I run a stress test.

I have a case with 4 fans: 1 inward-blowing in front, 1
outward-blowing on the sidem 1 outward-blowing on the back and the PSU
fan. The 3 main fans are Panaflo super quiet units.

http://www.directron.com/80l1a.html

The so-called case temp is 28C. The ambient temp in my home office is
26.7C (80F).

Make sure the heat sink is perfectly clean from dust. Even the
slightest amount of dust will clog it and airflow will be disrupted
causing heating. If you only have the PSU fan, get some extra fans.

If that doesn't cool things off consider a huge copper Zalman heat
sink - assuming it fits your AMD CPU. My son had to get one for his P4
3.2 GHz even though he had the retail box heat sink. When he loaded
the CPU it would get very hot. Now it stays relatively cool.

http://www.directron.com/cnps7700cu.html

Make sure it will fit the space in your mainboard, because it is huge.
There is a smaller one which may work.

http://www.directron.com/cnps7000balcu.html


--

Map of the Vast Right Wing Conspiracy
http://home.houston.rr.com/rkba/vrwc.html

"Nothing in the world can take the place of perseverence. Talent
will not; nothing is more common than unsuccessful men with talent.
Genius will not; unrewarded genius is almost a proverb. Education
will not; the world is full of educated derelicts. Persistence and
determination alone are omnipotent."
--Calvin Coolidge
 
mexican said:
hi

we are running amd 2800, 512 mb, gigabyte MB

the system temp is around 34 C and cpu around 45 C and is on for most
of the
day

the threshold temps are around 60 C


Was that a setting or value shown in the BIOS, or in some monitor
software program you load on Windows startup? If it was a monitor
program, which one? Motherboard Monitor (MBM), Everest, and even the
monitor programs from the mobo makers rely on tables or algorithms that
are dependent on which chipset is used. Use the wrong table and you get
the wrong temperature reported. If you don't want to believe me, go
find the MBM utility and select the wrong chipset to see that using a
different table results in vastly different reported temperature. Even
different versions of the same mobo-specific monitor program will show
different temperatures. Take a look at
http://www.amd.com/us-en/assets/content_type/white_papers_and_tech_docs/26237.PDF
to see that the formulae used to calculcate temperature are non-linear.
Figure the thermal diodes are not accurate to more than within 1 C and
often are more around 5 C in computer equipment.

72 C would be more appropriate for a max threshold to trigger a shutdown
or alarm since the CPU is rated for 85 C for the max die temperature (I
normally use 80 C as the upper bound due to the inaccuracy of computer
temperature sensing). Unless you are overclocking, you are okay if you
keep temperatures below the *rated* maximum temperature. At 60 C, you
are within the normal operating temperature range of the device.
Overclockers are concerned about [lower] temperatures because they want
to generate heat that exceeds the normal output and the normal thermal
transfer rate, so they must ensure a sufficient thermal *differential*
to draw the heat away *faster* from the die. Remember that the thermal
diode, even when on the die, is not directly measuring the heat or the
temperature of the component that is generating the heat. You may
generate more heat than the component can withstand to produce although
you are cooling it fast enough to maintain the "correct" temperature.
Temperature is a measure of level (kinetic energy), not quantity.
Warming your cup of coffee another 5 C higher is miniscule compared to
the heat increase of warming the oceans by that much.
 
hi

we are running amd 2800, 512 mb, gigabyte MB

the system temp is around 34 C and cpu around 45 C and is on for most of the
day


That's fine, but far more important is what the extended,
full-load temp is. Run a stress test like Prime95's Torture
Test for 45 minutes then check the temp (while it's still
running).

the threshold temps are around 60 C

Too low, most CPU are stable past 60C (at their stock speed,
not overclocked), and there should be no heat-related damage
till far higher. I'd increase that to 70C, maybe even a
little higher.

is this OK, as the fan is sometimes noisy and too quiet?

Noisey AND too quiet?
Hmmm.
Which fan?
Specifics might help... if the fan is failing then replace
it. If it's simply running at high RPM, you may need case
mods for more efficient air movement or just a different
fan. OR, the system might be working fine as per the
design- which you can alter to reduce noise if you find it a
problem.
 
Too low, most CPU are stable past 60C (at their stock speed,
not overclocked), and there should be no heat-related damage
till far higher. I'd increase that to 70C, maybe even a
little higher.

If I were you I would check with the manufacturer.


--

Map of the Vast Right Wing Conspiracy
http://home.houston.rr.com/rkba/vrwc.html

"Nothing in the world can take the place of perseverence. Talent
will not; nothing is more common than unsuccessful men with talent.
Genius will not; unrewarded genius is almost a proverb. Education
will not; the world is full of educated derelicts. Persistence and
determination alone are omnipotent."
--Calvin Coolidge
 
Don't use stock heatsinks and fans, pick up some artic silver thermal paste.
I have a vantec aeroflow on my 2800+ and my temp is 34 at full load. If you
want to you can clean up your wiring with some split loom(sleeving) and or
some wire ties. Have a couple fans blowing in and a couple blowing out.
Make sure you have a I/O shield on back of your computer. Thats the metal
shield that all your connections are in. Pick up a can of compressed air.
There are lots of things you can do that are inexpensive to help the
problem. If you don't wanna mess with sleeving buy a modular PS thats the
expensive way though. Cheers
 
I do, don't you?
ALL modern CPUs have temp specs above 60C.

According to a developer at Lavalys, makers of Everest:

http://www.lavalys.com/forum/index.php?showforum=16

"As for Athlon XP anything over 60C is too bad, and anything over 70C
is critical."

"In the case the CPU temperature you can see there [BIOS] exceeds 60C,
you can worry about overheating."


--

Map of the Vast Right Wing Conspiracy
http://home.houston.rr.com/rkba/vrwc.html

"Nothing in the world can take the place of perseverence. Talent
will not; nothing is more common than unsuccessful men with talent.
Genius will not; unrewarded genius is almost a proverb. Education
will not; the world is full of educated derelicts. Persistence and
determination alone are omnipotent."
--Calvin Coolidge
 
According to a developer at Lavalys, makers of Everest:

CPU specs come from the CPU manufacturer. It's pointless to
go elsewhere for someone's "opinion".
http://www.lavalys.com/forum/index.php?showforum=16

"As for Athlon XP anything over 60C is too bad, and anything over 70C
is critical."

The _FACT_ of the matter is that the average
(non-overclocked CPU and perhaps excluding the highest
speed-tier in any given core design) doesn't even have
stability issues until a little past 60C.

It is not a risk of physical damage at that point. This is
not just theory but has been demonstrated in practice by
countless people.

"In the case the CPU temperature you can see there [BIOS] exceeds 60C,
you can worry about overheating."


"Worry", no. Either it's an issue or not- if so it's fixed.
No worry either way. The question was one of where to set
a turnoff threshold, and setting it for 60C is usually
counter-productive for modern high-heat CPU such as a P4.

60C is not an ideal temp, it IS borderline for a
regular-running state. That is not an emergency situation
in which the bxo should shut-off with a loss of all data and
downtime.
 
kony said:
According to a developer at Lavalys, makers of Everest:

CPU specs come from the CPU manufacturer. It's pointless to
go elsewhere for someone's "opinion".
http://www.lavalys.com/forum/index.php?showforum=16

"As for Athlon XP anything over 60C is too bad, and anything over 70C
is critical."

The _FACT_ of the matter is that the average
(non-overclocked CPU and perhaps excluding the highest
speed-tier in any given core design) doesn't even have
stability issues until a little past 60C.

It is not a risk of physical damage at that point. This is
not just theory but has been demonstrated in practice by
countless people.

"In the case the CPU temperature you can see there [BIOS] exceeds 60C,
you can worry about overheating."


"Worry", no. Either it's an issue or not- if so it's fixed.
No worry either way. The question was one of where to set
a turnoff threshold, and setting it for 60C is usually
counter-productive for modern high-heat CPU such as a P4.

60C is not an ideal temp, it IS borderline for a
regular-running state. That is not an emergency situation
in which the bxo should shut-off with a loss of all data and
downtime.


I thought the *working* operating temperature range (for the Athlon)
went up to 85 C. That means the component is still supposed to be fully
functional without a loss in MTBF. All electronics have a working
temperature range. AMD says it is up to 85 C for the Athlon XP (but I
didn't see in their spec what is the lower limit). Their specifications
actually never mention a working or operating temperature range. I only
found the max die temperature of 85 C specified.

The Abit mobos that I have around all start at 85 C for the *shutdown*
threshold. They have an "alarm" threshold you can set from 50 to 250
(why would they go that high?) with a default setting of 75 C.
Presumably they figure that the sensing circuitry, even the on-die
dual-current sensing thermal diode, isn't that accurate (I usually
figure about ±5 C) and they want a bit of a buffer due to hysteresis;
temperature measures level (kinetic energy), not quantity, so the
temperature may be okay but too much heat is being generated or has yet
to dissipate. If a mobo thermistor is used, it is much less accurate
and reads lower than the die temperature and hence the need to have the
BIOS thresholds and/or warnings set lower.

I have the XP Barton and its spec says 85 C for the max working die
temperature. Other AMDs have other maximums: 95 C for Thunderbird, 90 C
for XP 1.33GHz, and so on (see http://www.gen-x-pc.com/cputemps.htm).
If you read AMD's own article at http://snipurl.com/fj7f, they
apparently do not list *normal* operating temperature ranges but they do
list *maximum* operating temperature ranges, usually just the max
temperature, but this is still an *operating* temperature.

It seems the overclockers have had way too much of an affect on users
judging what should be okay for a working temperature of their
processor. Overclockers need a greater temperature differential to
ensure the *excessive* heat output gets extracted as quickly as possible
to prevent damage to the component. If you are not exceeding the
specifications of the components then they should function per spec
within their full range of operating temperature range.
 
What is room temperature when measuring CPU temperature.
CPU temperature must be sufficiently low that the computer
works just fine (still does not exceed 85 degree C) even when
room temperature rises to exceed 100 degree F.
 
kony said:
the threshold temps are around 60 C

Too low, most CPU are stable past 60C (at their stock speed,
not overclocked), and there should be no heat-related damage
till far higher. I'd increase that to 70C, maybe even a
little higher.

If I were you I would check with the manufacturer.

I do, don't you?
ALL modern CPUs have temp specs above 60C.

According to a developer at Lavalys, makers of Everest:

CPU specs come from the CPU manufacturer. It's pointless to
go elsewhere for someone's "opinion".
http://www.lavalys.com/forum/index.php?showforum=16

"As for Athlon XP anything over 60C is too bad, and anything over 70C
is critical."

The _FACT_ of the matter is that the average
(non-overclocked CPU and perhaps excluding the highest
speed-tier in any given core design) doesn't even have
stability issues until a little past 60C.

It is not a risk of physical damage at that point. This is
not just theory but has been demonstrated in practice by
countless people.

"In the case the CPU temperature you can see there [BIOS] exceeds 60C,
you can worry about overheating."


"Worry", no. Either it's an issue or not- if so it's fixed.
No worry either way. The question was one of where to set
a turnoff threshold, and setting it for 60C is usually
counter-productive for modern high-heat CPU such as a P4.

60C is not an ideal temp, it IS borderline for a
regular-running state. That is not an emergency situation
in which the bxo should shut-off with a loss of all data and
downtime.


I thought the *working* operating temperature range (for the Athlon)
went up to 85 C. That means the component is still supposed to be fully
functional without a loss in MTBF.

Yes, the max temp is usually in that ballpark. That is, max
temp to avoid physical damage. Max temp for stability
depends more on the frequency headroom (and voltage used)
per a given core, but is always lower. All CPUs should be
stable a bit past 60C running at their stock speed.

All electronics have a working
temperature range. AMD says it is up to 85 C for the Athlon XP (but I
didn't see in their spec what is the lower limit). Their specifications
actually never mention a working or operating temperature range. I only
found the max die temperature of 85 C specified.

Variations in lot, specimen, and spec'd operating speed can
vary this temp.

Take an Athlon XP at run same core at two speeds, perhaps
1.4GHz and 2.0GHz. At 1.4GHz it should be stabe at a higher
voltage... that is, at the exact voltage which introduces
instability when at 2GHz, it should still be stable at
1.4GHz.

The Abit mobos that I have around all start at 85 C for the *shutdown*
threshold. They have an "alarm" threshold you can set from 50 to 250
(why would they go that high?) with a default setting of 75 C.
Presumably they figure that the sensing circuitry, even the on-die
dual-current sensing thermal diode, isn't that accurate (I usually
figure about ±5 C) and they want a bit of a buffer due to hysteresis;
temperature measures level (kinetic energy), not quantity, so the
temperature may be okay but too much heat is being generated or has yet
to dissipate. If a mobo thermistor is used, it is much less accurate
and reads lower than the die temperature and hence the need to have the
BIOS thresholds and/or warnings set lower.

I agree that variations in sensor accuracy can be an issue.
Setting the thermal cutoff should be secondary to first
running the system at full load to determine if the cooling
systems are adequate- if not, they need changed first to
establish an upper threshold of normal, stable operation.
At that point, one can use their own judgement to set a temp
high enough that it won't be exceeded under normal
operations... that temp should never be as low as 60C
though, IMO.

I have the XP Barton and its spec says 85 C for the max working die
temperature. Other AMDs have other maximums: 95 C for Thunderbird, 90 C
for XP 1.33GHz, and so on (see http://www.gen-x-pc.com/cputemps.htm).
If you read AMD's own article at http://snipurl.com/fj7f, they
apparently do not list *normal* operating temperature ranges but they do
list *maximum* operating temperature ranges, usually just the max
temperature, but this is still an *operating* temperature.

It seems the overclockers have had way too much of an affect on users
judging what should be okay for a working temperature of their
processor. Overclockers need a greater temperature differential to
ensure the *excessive* heat output gets extracted as quickly as possible
to prevent damage to the component. If you are not exceeding the
specifications of the components then they should function per spec
within their full range of operating temperature range.


It's not only that, but keeping the CPU cooler allows a
higher overclock. The hotter one gets, the more voltage is
needed to retain stability at a given frequency, which
further raises temp, requiring more voltage, etc, etc.

I tend to overclock only as much as can be done quietly. To
each their own.
 
w_tom said:
What is room temperature when measuring CPU temperature.
CPU temperature must be sufficiently low that the computer
works just fine (still does not exceed 85 degree C) even when
room temperature rises to exceed 100 degree F.

I'm sure humidity also plays a role. With higher temperatures, there is
typically higher humidity which means there is more heat in a volume of
air versus the same volume of dry air. With more heat already contained
in that volume of air, there is less capacity for that air to absorb
more heat. Same temperature but less heat absorption. A 100 F day in
Arizona is much more easily tolerated than a 100 F day in Florida. The
OP said the system temperature was 36 C (97 F) but then that is *inside*
the case so I'm guessing their room temperature is probably 75 F, or
lower. I doubt the OP is sweltering at 97 F *and* their system
temperature just happens to also match their room temperature. System
temperature will be higher than room temperature.

My room temperature is 74 F and the system temperature is at 104 F (40
C). The thermistor on my Abit mobo is between the CPU and the memory
(so it is at the top of the mobo) and that is probably the warmest spot
in the box, so I'm not surprised that my system temperature is at 104 F.
With the hard drive, video card, memory, chipset, SCSI controller, sound
card, and other components all pre-warming the air that gets delivered
to the CPU, you already have reduced the thermal differential.
Something interesting I came across is to build a duct that runs from
the side panel straight to the CPU's fan so the air you use to cool the
CPU is at room temperature instead of using the pre-warmed system air.
This will probably not much affect the system temperature because
everything that was pre-warming the intake air is still warming that air
and the same amount of heat is in the air going through the PSU to cool
its parts, but you do get the CPU to run only around 9 C higher than the
room temperature. See http://www.overclockers.com/tips586. Sure sounds
a lot easier than running tubes and pumps around inside to use a liquid
thermal transfer medium, Peltier plates, chilling the air, or even
having to add lots of fans and increase the noise. If the point is to
cool down the CPU then use the coldest air you have available, and that
is NOT the pre-warmed intake air. Although the author rigged up his own
ductwork, I recall seeing a standard manufactured duct that runs from
the backpanel (i.e., you usurp the backpanel fan grill space to use for
the duct that runs to the CPU). Because I am running within the
operating temperature range of the CPU, I have no need to go to such
drastic results, but eventually I might toy with overclocking. This is
also why reversing the backpanel case fan (so it intakes rather than
exhausts) can also end up producing lower temperatures (for both CPU and
system): you're sucking in the cooler outside air with little to warm it
before it gets delivered to the CPU's heatsink (but be sure NOT to use a
thermo-controlled fan when used for intake because it will spin slower
due to the lower sensed temperature on its thermister). If your
potential exhaust airflow rate exceeds your intake airflow rate, you're
making a lot of noise for nothing (you can't eject more than you get).

Regardless of what is the OP's room temperature, or what is their system
temperature, he/she reported a CPU temperature of 45 C and that seems
well below the maximum or critical threshold, so the OP's processor is
within its working temperature range. The OP didn't mention if the 60 C
threshold setting was in the BIOS and whether it was the shutdown
threshold or just the alarm threshold, or if that threshold was in some
software monitor. 60 C is too low *if* it is the shutdown threshold
since the processor is rated to 85 C. Since this is a catastrophic
prevention setting, there is no reason not to set this shutdown
threshold lower than 85 C, or whatever is the max recommended CPU
temperature by the manufacturer (but I'd probably give myself a 5 C
hedge below that max). If it is just a warning threshold to sound an
alarm, 60 C still sounds too low. 75 C would be more appropriate.
Otherwise, like you said, on a really hot day (with no A/C), the OP's
box might be sounding off alarms at 60 C for the CPU temperature when in
fact no harm will occur until more than 25 C later. However, if the OP
never experiences a CPU temperature that exceeds 60 C, or gets close,
then that would be okay as a alarm/warning threshold (but NOT as a
shutdown threshold).
 
I'm sure humidity also plays a role. With higher temperatures, there is
typically higher humidity which means there is more heat in a volume of
air versus the same volume of dry air.

It takes more energy to change the temp of the air though.

With more heat already contained
in that volume of air, there is less capacity for that air to absorb
more heat.

No, with the higher density, more heat is absorbed per each
degree change in the air temp.


Same temperature but less heat absorption. A 100 F day in
Arizona is much more easily tolerated than a 100 F day in Florida.

.... for different reasons- that a dry heat allows human
perspiration to evaporate more quickly, providing more
cooling.

The
OP said the system temperature was 36 C (97 F) but then that is *inside*
the case so I'm guessing their room temperature is probably 75 F, or
lower. I doubt the OP is sweltering at 97 F *and* their system
temperature just happens to also match their room temperature. System
temperature will be higher than room temperature.

Insuffficent data, but certainly the room temp must be lower
than *overall* system temp.

My room temperature is 74 F and the system temperature is at 104 F (40
C). The thermistor on my Abit mobo is between the CPU and the memory
(so it is at the top of the mobo) and that is probably the warmest spot
in the box, so I'm not surprised that my system temperature is at 104 F.
With the hard drive, video card, memory, chipset, SCSI controller, sound
card, and other components all pre-warming the air that gets delivered
to the CPU, you already have reduced the thermal differential.

True, though among the greatest issues is recirculated air,
that exhausts out the heatsink then is drawn back into it.
A snorkel/duct to isolate the exhaust reduces that, but also
reduces the flow rate... it's a trade-off either way, unless
of course the chassis has a rear fan to assist the exhaust
of the CPU fan, but then the snorkel reduces the exhaust
from entire chassis, a higher noise/flow ratio, which could
be similar enough to simply doing without the duct
altogether and using the potential of the rear fan to move
more air in total, which also cools other components better.

All all components, I care least about CPU temps. IMO, data
is worth more, time is worth more, video card and
motherboard may be worth more as well after a little time
has passsed and the CPU's value has technologically
depreciated. Then again, I don't run overclocked P4
Prescotts, so I can have more latitude in these things...
Smoeone with a CPU putting out over 120W of heat will have
to focus on that and most everything else will be cool
enough simply as a by-product of keeping the CPU cool,
unless the heat is removed without corresponding airflow
increase- as is often the case with water-cooling
 
"No, with the higher density [for more humid air], more heat is absorbed
per each degree change in the air temp."

Except humid air is lighter (i.e., LESS dense)! Remember that humidity
is a gas and as such hydrogen (in the water) is lighter than nitrogen or
oxygen. See http://usatoday.com/weather/wdensity.htm. You are not
adding more molecules into the same volume to increase its density. You
are replacing the lighter water molecule (molecular weight = 18) for the
heavier molecules of nitrogen (28) or oxygen (32). Humid air is LESS
dense air.

Alternatively, you can take a look at
http://www.geosp.uq.edu.au/UQWEATHER/airdensity.htm where you see
increasing the relative humidity means a larger *negative* number that
reduces the computed value. You can also go to
http://wahiduddin.net/calc/calc_da_rh.htm and enter 0 (zero) for
altitude (sea level), 100 F for temperature (w_tom's mention, or
whatever you like), 29.63 for barometric pressure (uncorrected for
altitude), and put in 0, 20, 50, and 85 for the relative humidity.
Notice as you go up in relative humidity that the density goes DOWN.

Temperature is a measure of the average kinetic energy (momentum) of the
molecules. With an average momentum that is equal for all molecules
regardless of their constituent atoms, it could be that the only or
major reason why humid air is less efficient than dry air for cooling is
because of the slightly reduced density of humid air. While temperature
is a measure of kinetic energy for the molecules, is nothing of their
collision stored within the atom itself? Collisions change the
excitation state of the electrons, as do photons, so some of the
collision is stored within the atom itself. Hydrogen with its 1 atom
can't compete with nitrogen with its 7 electrons and oxygen with its 8
electrons. However, while this differs how much of the collision might
be saved within the atom, maybe it has nothing to do with affecting
temperature since that is a measure of kinetic energy (with regard to
momentum which requires velocity).

So where are those degreed thermodynamics graduates?
 
"No, with the higher density [for more humid air], more heat is absorbed
per each degree change in the air temp."

Except humid air is lighter (i.e., LESS dense)! Remember that humidity
is a gas and as such hydrogen (in the water) is lighter than nitrogen or
oxygen. See http://usatoday.com/weather/wdensity.htm. You are not
adding more molecules into the same volume to increase its density. You
are replacing the lighter water molecule (molecular weight = 18) for the
heavier molecules of nitrogen (28) or oxygen (32). Humid air is LESS
dense air.

Are you certain of this?
You wrote "you are not adding more molecules", but that is
exactly what must happen if the water changes into a gas, it
is inescapable that this forces more molecules into the same
area... not only the air but the water vapor too. The
atmosphere cannot expand indefinitely, it is constrained.

The link mentioned "at the same temperature and pressure",
which cannot remain constant.

Perhaps I'm thinking on a global scale instead of localized,
in that the specific area having the increase in water vapor
is thus forcing more air molecules into areas of lower water
vapor.

That does seem to make sense to me, thanks for the links.

Does this impact the cooling of the CPU though? As air
density drops, won't it then flow more freely though the
impedance of the chassis and 'sink, since fans have finite
power to move this air?
 
kony said:
"No, with the higher density [for more humid air], more heat is
absorbed
per each degree change in the air temp."

Except humid air is lighter (i.e., LESS dense)! Remember that
humidity
is a gas and as such hydrogen (in the water) is lighter than nitrogen
or
oxygen. See http://usatoday.com/weather/wdensity.htm. You are not
adding more molecules into the same volume to increase its density.
You
are replacing the lighter water molecule (molecular weight = 18) for
the
heavier molecules of nitrogen (28) or oxygen (32). Humid air is LESS
dense air.

Are you certain of this?
You wrote "you are not adding more molecules", but that is
exactly what must happen if the water changes into a gas, it
is inescapable that this forces more molecules into the same
area... not only the air but the water vapor too. The
atmosphere cannot expand indefinitely, it is constrained.

The link mentioned "at the same temperature and pressure",
which cannot remain constant.

Perhaps I'm thinking on a global scale instead of localized,
in that the specific area having the increase in water vapor
is thus forcing more air molecules into areas of lower water
vapor.

That does seem to make sense to me, thanks for the links.

If you force more *gas* (i.e., the water molecules) into the same volume
of air without letting it replace those molecules of air, you have more
molecules in the same volume (i.e., the molecules for the air and those
for the water) which means you are upping the pressure. Us common folk
still get stuck on the concept that the air is "holding" the water vapor
when in fact it they are H2O water molecules. Because you are talking
about gases, you have to keep temperature and pressure constant if you
are going to discuss density. How do you add gas from one balloon to
the gas already present in another balloon without increasing pressure
if the ballon isn't allowed to expand so the pressure inside remains the
same as before.

I know, it was contrary to what I thought, too, until I started
researching some physics regarding humidity. Remember that we are not
talking about condensation or water that is suspended or present within
the atmosphere, like rain, snow, mist, or vapor (which are droplets of
*liquid* water, and which occupy space so molecules of air would have to
be remove to allow the liquid to replace its volume to keep pressure
constant). The articles pretty much explain themselves, and the fact
that you replace lighter hydrogen atoms for some of the heavier nitrogen
or oxygen atoms then made it clear why density decreased when water, as
a gas, was added to the air (which, in fact, must replace molecules of
the air to prevent increased pressure).
Does this impact the cooling of the CPU though? As air
density drops, won't it then flow more freely though the
impedance of the chassis and 'sink, since fans have finite
power to move this air?

I have no data regarding the turbulence (i.e., resistance) of reduced
density for air+water. Since it is likely there is almost no laminar
airflow anywhere within the computer box, I would suspect turbulence far
exceeds what a change in density might accomplish for reduced friction.
Considering that you are using axial fans instead of radial (or
tangential) blowers, that the case airflow design is meant to bend (in,
up, and back), with all the cables in the way (some of which may be fat
wide ribbon cables) along with every protrusion, and not even the
heatsink is designed for laminar airflow (air gets pushed in and hits
the edges of the fins and then has to make a 90-degree bend in 2
directions (sometimes 4), along with the accumulation of dust, there is
a lot of turbulence inside a computer case. Axial fans are used because
the provide a better ratio of airflow rate to noise level than for
blowers.

Airflow through a computer case is very sloppy. Intake ports at the
front that make bends to side ports around the chassis, often through
restrictive openings, and through cable openings, a bunch of "blades"
(expansion cards in slots) running across the airflow when it bends
upward (rather than exhausting alongside the card through the card edge
slot), hitting the CPU and other heatsinks and chips on the motherboard,
having the CPU fan blowing 90-degrees across the airflow through the
case, cables everywhere (some flat and across the airflow), and so on.
It is just a mess of turbulence within a computer box. Rather than have
the fan on the side of the heatsink to blow air across its parallel
fins, the fan blows down where the air must bend 90 degrees which
creates backpressure. Just consider the design of an axial fan where
the cylinder core area for the motor doesn't push any air so the airflow
has to swirl on exit, along with the vortices at the tips of the blades.

I doubt a small reduction in density for the gas passing through a
computer case could ever overcome the horrific level of turbulence
intrinsic to computers (for desktops; I haven't cannibalized a laptop to
see if they use tangential blowers and/or attempt to maintain laminar
airflow. There are some laminar fans you can get for computers but then
you have to design the computer components for laminar airflow, too.
Turbulence causes resistance so more power is required to move the same
mass of air within the same amount of time. Eddies in airflow can also
cause hotspots. I'm not sure, other than convenience, why CPU fans blow
down against the heatsink instead of placed on the side to blow across
the fins without any bends in that particular airflow for that
component. Maybe it was to allow short but fat heatsinks instead of
tall but skinny ones. I haven't seen a study showing thermal transfer
of a setup where the fan blows across the heatsink instead of at it.
 
If you force more *gas* (i.e., the water molecules) into the same volume
of air without letting it replace those molecules of air, you have more
molecules in the same volume (i.e., the molecules for the air and those
for the water) which means you are upping the pressure. Us common folk
still get stuck on the concept that the air is "holding" the water vapor
when in fact it they are H2O water molecules. Because you are talking
about gases, you have to keep temperature and pressure constant if you
are going to discuss density.

We do not have to presume that pressure remains the same.
There can be a density and a pressure change... and it
appears there is, that it is manditory because displaced air
molecules do not disappear, if they are not considered in
the water-vapor-containing air, they must be a component of
the contrasted air without the added water vapor.
How do you add gas from one balloon to
the gas already present in another balloon without increasing pressure
if the ballon isn't allowed to expand so the pressure inside remains the
same as before.

That's just it, it doesn't expand because it's not a
balloon.

To clarify my arguement, water vapor does increase density.
The link you provided is wrong. The reason why it is wrong
is that it ignores that the water vapor is being discussed
as an addition, rather than a difference in concentration.
When you add water vapor to the air, the sum total of ALL
air density does rise. BUT, the link only focused on the
localized concentration of air molecules, not the entire
system. It ignored that the displaced air molecules are
denser in the area of the lower-water-vapor %, due to the
pressure increase.

Taking your ballons as an example, if we have two balloons
as a closed system, and both are equally filled with air and
water. The water in one is vaporized, which causes an
increase in pressure. Even though the ballon expands, the
pressure does still increase. If we manged to trap all the
water vapor in one ballon and only equalize the pressure
between them, that results in the other ballon having higher
pressure too. While the ballon with higher water vapor is
less dense, the water vapor did, in the larger picture,
increase the air density of the entire system... because we
now consider the water vapor as a component of the air.

I know, it was contrary to what I thought, too, until I started
researching some physics regarding humidity. Remember that we are not
talking about condensation or water that is suspended or present within
the atmosphere, like rain, snow, mist, or vapor (which are droplets of
*liquid* water, and which occupy space so molecules of air would have to
be remove to allow the liquid to replace its volume to keep pressure
constant). The articles pretty much explain themselves, and the fact
that you replace lighter hydrogen atoms for some of the heavier nitrogen
or oxygen atoms then made it clear why density decreased when water, as
a gas, was added to the air (which, in fact, must replace molecules of
the air to prevent increased pressure).

That brings me back to my original concern though, that one
cannot simply "replace" air moleclues with water molecules,
because the air molecules don't cease to exist.
Considering density in this context is an impossible
situation, IMO, if one wants to fix the pressure as
constant. I would argue that it is never a fixed pressure,
that any consideration is only valid if argued in the
context of increased pressure- previously there were X
number of air molecules, plus Y water molecules, in the same
space that formerly occupied only X. Air cannot simply
"expand" without limits until it remains at same pressure-
That we have an atmosphere on our planet is evidence enough.


Airflow through a computer case is very sloppy. Intake ports at the
front that make bends to side ports around the chassis, often through
restrictive openings, and through cable openings, a bunch of "blades"
(expansion cards in slots) running across the airflow when it bends
upward (rather than exhausting alongside the card through the card edge
slot), hitting the CPU and other heatsinks and chips on the motherboard,
having the CPU fan blowing 90-degrees across the airflow through the
case, cables everywhere (some flat and across the airflow), and so on.
It is just a mess of turbulence within a computer box. Rather than have
the fan on the side of the heatsink to blow air across its parallel
fins, the fan blows down where the air must bend 90 degrees which
creates backpressure. Just consider the design of an axial fan where
the cylinder core area for the motor doesn't push any air so the airflow
has to swirl on exit, along with the vortices at the tips of the blades.

I doubt a small reduction in density for the gas passing through a
computer case could ever overcome the horrific level of turbulence
intrinsic to computers (for desktops;

It doesn't have to "overcome", the system can be considered
fixed, that the turbulence is present either way.
Turbulence is only created by moving the air, so if the fan
moves less air, that in itself is significant... just as it
would be if one reduced the fan RPM, because fans will
actually have an RPM reduction- their RPM is not fixed but
variable based on the load, if given a constant voltage...
at least this is the case with almost every "PC" unregulated
fan.

I haven't cannibalized a laptop to
see if they use tangential blowers and/or attempt to maintain laminar
airflow.

I suspect you make too much of laminar airflow. There can
be quite a bit of turbulence in a large area and be of
minimal effect providing the intake and exahust are
unimpeded.
There are some laminar fans you can get for computers but then
you have to design the computer components for laminar airflow, too.
Turbulence causes resistance so more power is required to move the same
mass of air within the same amount of time. Eddies in airflow can also
cause hotspots. I'm not sure, other than convenience, why CPU fans blow
down against the heatsink instead of placed on the side to blow across
the fins without any bends in that particular airflow for that
component. Maybe it was to allow short but fat heatsinks instead of
tall but skinny ones. I haven't seen a study showing thermal transfer
of a setup where the fan blows across the heatsink instead of at it.

Turbulence on the surface of a heatsink fin is a positive
thing. It breaks though surface boundary layers to remove
heated air faster, which had slowed upon contact with the
fins' surfaces.
 
Preheated air will cool the CPU heatsink less. And then
we apply the numbers. That lesser cooling is minimal - in
humid air or dry air. Even thermodynamic effects are
irrelevant at these minimal temperature differences.
Furthermore, more humidity means air can absorb more heat.
But again, this is irrelevant once we apply the numbers - put
everything into perspective. Rationalizing without numbers
can lead to wild speculation about irrelevant microscopic
effects. If rationalizing and not providing the underlying
numbers, then one is setup for junk science reasoning.

AMD processors are typically good for 90 degree C. So one
would set a maximum temperature of 85 degree C to provide a
protective cushion. That means even when room temperature is
above 100 degrees F (and all computers must work normally at
temperatures that high), then the CPU temperature must be that
much lower in a 70 degree F room.

The problem is not that a 60 degree C CPU is too hot. With
minimally standard components, the CPU should be operating at
a slightly less temperature. What is wrong with installation
or selection of that fan heatsink? Did they install too much
thermal compound? Is the heatsink so poorly machined that it
even was provided with a thermal pad? What is the degree C
per watt rating for that heatsink? This last question is a
first to be answered because it demands and provides numbers.
Again, get numbers before speculating. Inferior heatsink
assemblies would rather not provide that number. Did its
manufacturer provide that number? If not, then what is he
trying to hide?

60 degree C is not too hot. But it does suggest something
improperly designed or improperly installed.
 
Your reasoning of 'removing molecules that would be replaced
by other molecules' violates principles of ideal gas laws and
partial pressures. Completely irrelevant whether the
atmosphere is fixed or expands. Furthermore, concepts become
more complex with the study of thermodynamics. With large
changes, then ideal gas laws break down and instead follow
thermodynamic principles. However we are not discussing large
number changes. The numbers associated with CPU cooling are
so trivial as to be irrelevant to thermodynamics analysis, air
pressure changes, or atmosphere composition. To adversely
effect air cooling, air pressure must change to numbers that
are less able to support human life. We are not discussing
such major changes. All that above reasoning becomes
irrelevant once we provide a prespective called numbers.

Turbulence both adversely affects and improves cooling. But
we don't care. Copper inside a heatsink may or may not improve
cooling - depending on how it was designed. But again, we
don't care. Heatsink fan's CFMs affect cooling. But again, we
don't care. It is part of a design number called 'degree C
per watt' - that responsible heatsink manufacuturers provide
with every heatsink assembly. What is the 'degree C per watt'
for that heatsink? If not provided, then why not?
If you allow the pressure to change then density is a non-issue. If you
want to compare a change in density regarding thermal transfer, you
can't be changing the pressure (and thusly the volume, too). You could
up the pressure to provide whatever density you wanted.
...

No one said they disappear. They move somewhere else. That's why the
atmosphere doesn't have a restricted volume; i.e., we don't have a rigid
dome covering out atmosphere to prevent expansion (and contraction). A
huge meteor hitting the Earth can blow the atmosphere far enough away
that it won't return (too far for gravity to pull it back) due to its
explosion of solids turned into gases that *displaces* the atmosphere.
The atmosphere didn't disappear. It got pushed out to a larger volume.
Yeah, there would be compression (pressure increase) during the
explosion but afterward the impetus velocity imparted to the atmosphere
along with it being too far from Earth would have it drift away.

Pressure is determined by gravity (by the weight of the column of gases
over a geographical point). If it were a column of humid air, the
density is less at any altitude along the column compared to column of
non-humid air. A column of hydrogen or helium would exert even less
pressure from its column of molecules. Humid air contains hydrogen
whereas dry air did not and instead retains its heavier molecules.

By the way, barometric pressure DECREASES with an increase in humidity.
See http://www.coscosci.com/barometric/barometer.htm. Note as the
pressure decreases (lower height in the mercury pushed up in the other
vertical tube) that there is more chance of precipitation (because there
is more humidity). Since the weight of a volume of air (due to gravity)
depends on its density, lower density means less weight, so less
pressure on the open column of mercury to push it down and then up into
the next sealed tube to compress that fixed quantity of gas.

So pressure is actually decreasing due to the reduce density when
hydrogen replaces nitrogen and/or oxygen. You get both decreased
density and decreased pressure with humid air. If the volume were to
remain the same and you removed molecules then you would realize that
you have reduced density and hence the weight of that volume of air. So
instead of removing molecules, you swap them with lighter molecules.
...

The atmosphere is not a fixed volume.
...

Again coming back to the misconception that the atmosphere is a fixed
volume. You are not adding water (gaseous or liquid) into a box that
has a fixed volume. Adding water vapor (i.e., in its gaseous form)
means having to displace molecules already there. Unlike an experiment
where you might pump the water vapor into a fixed sized box which would
result in upping the pressure inside, you are adding water vapor to the
*atmosphere* which can expand, so the pressure is not increased by
adding more molecules to the same volume but by pushing out the heavier
atoms with lighter ones with a consequential weight change due to the
reduced density.
Turbulence on the surface of a heatsink fin is a positive
thing. It breaks though surface boundary layers to remove
heated air faster, which had slowed upon contact with the
fins' surfaces.

Which goes against what HVAC engineers will claim, that turbulence (to
maintain the same flow rate) is resistance which means you have to add
more energy to the airflow which means its kinetic energy is higher
which means its temperature is higher which means there is less thermal
differential. Also, please explain what you mean by "surface boundary
layers". A molecule of air against a higher temperature surface will
become more kinetic. However, you still want to move that molecule of
air *away* from the surface from which you are extracting heat.
Obviously laminar airflow that is perfectly parallel to the other
surface may never impact that surface to receive kinetic energy from the
collision. But a laminar flow of air against a surface (by angling it
against the surface) doesn't need to itself generate [much] turbulence
so that molecule's average velocity is away from the surface rather than
at it or against the direction of airflow; see
http://www.electronics-cooling.com/Resources/EC_Articles/MAY96/may96_01.htm
where the angle of attack is mentioned. Also, even if the flow were
laminar (or maximal) for the CPU heatsink, you still have to get that
heated air away from the heatsink, and turbulent airflow inside the case
can have that warmed air returned and result in a slow heat exchange.
Even if the airflow were designed to go straight across the box from
front to back with an equal volume delivered across the entire span of
the front of the case, there is no way that the laminar airflow would be
perfectly parallel to every component on the mothboard, expansion card,
chips, CPU, etc.

Another advantage of laminar airflow is less accumulation of dust. The
average velocity of the dust particle is along the path of the intended
airflow instead of impacting against the surfaces (or against the
airflow to let the dust settle). If laminar airflow wasn't important in
increasing thermal transfer, why are tangential fans manufactured (and
which cost a lot more)? Because you cannot afford as much turbulence
within a confined rack-mounted device as you can with the sloppy design
of a desktop box. With turbulent air, you have to impart more energy to
it to get the same flow rate (due to the resistance of the turbulence)
which means it already has more kinetic energy when it reaches whatever
you are trying to cool. When Googling on "+laminar +airflow +cooling",
I often see statements like, "This turbulence creates noise, slows the
airflow before exiting, and reduces effective cooling.
(http://www.equipmentprotectionmagazine.com/eprints/UAF.htm)". Also,
laminar airflow reduces contamination (dust) because the particulate is
less likely to settle on the surface whereas "turbulent airflow
ventilated system relies on mixing and dilution to remove
contamination". The accumulation of dust (a thermal insulator) easily
outstrips any arguments, er, discussions we've had regarding humidity,
density, and pressure changes.

Even if you think turbulence was necessary for thermal transfer, the
axial fans used on heatsinks will certainly guarantee a turbulent
airflow. However, putting them on top where they have to push their
exhaust against the solid heatsink at the base side of the fins means
you generate backpressure which reduces airflow speed (I believe this
also reduces fan RPM). Whether turbulent or laminar, I would think
having the fan blow across the fins with the air exit leaving the fins
without impacting a 90-degree surface (i.e., no backpressure) would work
much better, but apparently there are design contraints for that method.
Maybe the heat wouldn't transfer fast enough across longer fins, so you
sacrifice efficiency for effected cooling rate and damn the increased
noise from the turbulence.

Yeah, I'm pretty sure we're by ourselves in this subthread. All this
miniscule stuff probably is insignificant to effective cooling although
turbulence inside the case can be and is often pretty bad unless you are
very neat in routing or orienting your cables and other components
inside (within the restrictions of the hardware provided (I've seen a
case get 7 C cooler by moving cables out of the way or making sure the
ribbon cables are inline with the airflow instead of block it). I doubt
slight changes in *absolute* humidity and barometric pressure much
affect computer cooling. Originally I was discussing the *operating*
temperature range for the Athlon. Mentioning that humidity could affect
cooling got us way off track (and I bet another subthread about the
stored energy in the excitation levels of hydrogen's 1 electron in 1
shell with 1 energy level versus the 7 or 8 electrons in multiple shells
with multiple energy levels in each shell for nitrogen and oxygen would
be even more esoteric). The amount of turbulence and its incumbent
problems probably overwhelms any effect due to humidity, small pressure
change, and molecular energy levels. It's been fun, though.
 
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