CPU goop question

  • Thread starter Thread starter Steve Conover
  • Start date Start date
Noozer said:
Actually, after thinking about it, a bit more for AMD64, etc... CPU's with
large heat spreaders.

Basically JUST enough to cover the contact area. What you want it only
enough to remove any air gaps but not so much that it will stop the metal to
metal contact.
Click to expand...

No, wrong set theoretique. One has no control of what gets filled and what
doesn't. The clamping force determines the final gap which may take a few
days to fully realize. On wants to add enough compound in such a pattern
that after a few days one can see a small bead oozing out around the entire
periphery of the thermal contact area. One wants to add the compound in
such a fashion that air pockets are unlikely to be included and any such get
expelled during the settling/oozing period. The way I do that is too spread
a bead in a X pattern(corner to corner) with a little extra dead center and
then clamping. The total volume of nonconductive paste I use is about half
a new #2 pencil erasers worth.

Next time you remove it one can observe how well it worked.
 
obsessively said:
Or just get some radio shack goop and spread it over the contact
surfaces like they've been doing for sixty years.
Click to expand...

Use a razor edge to remove most of it - it only takes a very thin
coating to make a good thermal conduit. Too much and it acts like an
insulator.
 
Next time you remove it one can observe how well it worked.
Click to expand...

LOL, a new theology of goop ;)

Just practice with clear plastic squares from Tap Plastics.
Or get a grant to put a few supercomputers on the job of calculating
the correct geometric application pattern of goop.

Or just get some radio shack goop and spread it over the contact
surfaces like they've been doing for sixty years.
 
Dave said:
Try removing goop with alcohol. Buy some Arctic Silver - add a dab the
size of a grain of rice. Don't risk overheating your cpu.
Click to expand...

Artic Silver is great, but it also acts like glue. Be careful if you
have to remove the heatsink in the future. It is likely to pull the
cpu from the socket rather than separate.

Wayne
 
W Shumaker said:
Artic Silver is great, but it also acts like glue. Be careful if you
have to remove the heatsink in the future. It is likely to pull the
cpu from the socket rather than separate.
Click to expand...

I heard that the pads from Intel and CM were like that, but not the AS 5
paste.
Any others remove a HSF with AS 5 more easily?
 
Artic Silver is great, but it also acts like glue. Be careful if you
have to remove the heatsink in the future. It is likely to pull the
cpu from the socket rather than separate.

Wayne
Click to expand...

I can personally attest to this fact. :(

Kevin Miller

"Either way, it is bad for Zathras."
 
W Shumaker said:
Artic Silver is great, but it also acts like glue. Be careful if you
have to remove the heatsink in the future. It is likely to pull the
cpu from the socket rather than separate.
Click to expand...

So exactly how is the HSF removed? Isn't it best to pull it straight up, so
as not to bend pins?
I guess just the right amount of force is critical.
I have a Zalman 7000, I would only remove it if the fan or CPU failed.
 
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