CPU goop question

  • Thread starter Thread starter Steve Conover
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Steve Conover

I am returning a defective mb, and all the components are back in
their boxes waiting for the new mb.

My CPU's cooling unit came with a thermal pad; (by design) it was
squashed against the CPU when I installed it. When I uninstalled
it, some of the squashed goop stayed with the CPU, the rest of it
went with the cooling unit. The segment that stayed on the CPU
is shaped approximately like Korea, or that thing on Gorbachev's
head (take your pick).

My question is this: As long as I match the goop segment on the
CPU with the goop void on the cooling unit (i.e., -Korea matched
with +Korea), will the CPU be cooled sufficiently after I install
it on my new mb? Or should I plan to get some supplemental goop?

Thanks,
Steve


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It will probably work, but those pads are designed for "one time use",
and the recommended procedure is to completely remove all traces of the
pad from both CPU and heatsink, and use thermal compound on the remount.
 
Try removing goop with alcohol. Buy some Arctic Silver - add a dab the
size of a grain of rice. Don't risk overheating your cpu.

Dave - N2LAK
 
Arctic silver is conductive, you have to be careful with it, too much
can cause lots of problems. Unless it's an unusual situation, I prefer
the old-fashioned "white" silicone thermal compound for most routine
situations.
 
Don't use BOTH. Either use just the [damaged] thermal pad, or clean it
up/off and use just thermal compound (of whatever type).

The risk in reusing the pad is that you won't get the two parts lined up
"perfectly", at places the two parts will overlap, creating double
thickness in some spots and single thickness in other spots, and
generally reduced thermal conductivity.

A better approach might be to remove "korea" from the CPU and put it
back onto the heatsink, if you can do that without dividing "Korea" up
into a whole bunch of "provinces".
 
Steve Conover said:
I am returning a defective mb, and all the components are back in
their boxes waiting for the new mb.

My CPU's cooling unit came with a thermal pad; (by design) it was
squashed against the CPU when I installed it. When I uninstalled
it, some of the squashed goop stayed with the CPU, the rest of it
went with the cooling unit. The segment that stayed on the CPU
is shaped approximately like Korea, or that thing on Gorbachev's
head (take your pick).

My question is this: As long as I match the goop segment on the
CPU with the goop void on the cooling unit (i.e., -Korea matched
with +Korea), will the CPU be cooled sufficiently after I install
it on my new mb? Or should I plan to get some supplemental goop?
Click to expand...

Add proper goop. On dab about half the volume of a standard pencil eraser
will do.
 
Barry Watzman said:
Don't use BOTH. Either use just the [damaged] thermal pad, or clean it
up/off and use just thermal compound (of whatever type).

The risk in reusing the pad is that you won't get the two parts lined up
"perfectly", at places the two parts will overlap, creating double
thickness in some spots and single thickness in other spots, and
generally reduced thermal conductivity.

A better approach might be to remove "korea" from the CPU and put it
back onto the heatsink, if you can do that without dividing "Korea" up
into a whole bunch of "provinces".
Click to expand...

No, dump the geography and use goop.
 
My question is this: As long as I match the goop segment on the
Add proper goop. On dab about half the volume of a standard pencil eraser
will do.
Click to expand...

I don't know where you get your pencils, but that's **WAY** too much!

A grain of rice is a good amount.
 
Steve said:
I am returning a defective mb, and all the components are back in
their boxes waiting for the new mb.

My CPU's cooling unit came with a thermal pad; (by design) it was
squashed against the CPU when I installed it. When I uninstalled
it, some of the squashed goop stayed with the CPU, the rest of it
went with the cooling unit. The segment that stayed on the CPU
is shaped approximately like Korea, or that thing on Gorbachev's
head (take your pick).

My question is this: As long as I match the goop segment on the
CPU with the goop void on the cooling unit (i.e., -Korea matched
with +Korea), will the CPU be cooled sufficiently after I install
it on my new mb? Or should I plan to get some supplemental goop?

Thanks,
Steve

Delete the ZZZ.
It keeps spam
off the server.
Click to expand...

clean off the old, thermal pads are destroyed when left to air. AMD
specifically mentions that thermal pads must be placed immediately after
the backing is removed.

That said, carefully scrape off the old paste from the heatsink, you can
use an old credit card, or your fingernail, then use some 99% alcohol on
a qtip to wipe the remainder off, Push hard because there are minute
channels in the heatsink. Go in each direction, use another qtip and
alcohol to clean the cpu die.

Go to your local computer store/builder and ask the service dept to sell
you a thermal pad for a buck. Thermal grease is only recommended for
short term builds.

Gordon
 
Gordon Scott said:
Go to your local computer store/builder and ask the service dept to sell
you a thermal pad for a buck. Thermal grease is only recommended for
short term builds.
Click to expand...

NO, when properly applied and clamped good thermal compound is the superior
product for any term build. A pad is convenient and less sloppy but
provides INFERIOR thermal coupling and will degraded with time FASTER than
good thermal compound.
 
LOL war over compound or pads, come on 99.9% of gamers use compound! I know
what they are trying to get rid of and it aint there cpu!

Steve let us know how you go when your new board arrives I read a similar
problem to yours which turned out to be a bank of memory on the board was
not working right which could have meant both purple and orange slots were
faulty on one side.

cheers
sheer
 
Barry Watzman said:
Arctic silver is conductive, you have to be careful with it, too much
can cause lots of problems. Unless it's an unusual situation, I prefer
the old-fashioned "white" silicone thermal compound for most routine
situations.


Dave Hines wrote:
Click to expand...


http://www.arcticsilver.com/as5.htm

"Arctic Silver 5 was formulated to conduct heat, not electricity.
(While much safer than electrically conductive silver and copper greases,
Arctic Silver 5 should be kept away from electrical traces, pins, and leads.
While it is not electrically conductive, the compound is very slightly
capacitive and could potentially cause problems if it bridges two
close-proximity electrical paths.)"
 
Noozer said:
I don't know where you get your pencils, but that's **WAY** too much!

A grain of rice is a good amount.
Click to expand...

A grain of rice of AS5 probably wont be enough.. Unless your not actually
spreading it of course.. I would say that a new #2 pencil with the size of
the eraser going past the eraser holder would probably mean half of that
should be okay :P .. By the ti me you use a glove/bag/stick/CC/whatever to
spread as5 out then you'll loose half of it on the item itself..
 
Actually, after thinking about it, a bit more for AMD64, etc... CPU's with
large heat spreaders.

Basically JUST enough to cover the contact area. What you want it only
enough to remove any air gaps but not so much that it will stop the metal to
metal contact.
 
Noozer said:
I don't know where you get your pencils, but that's **WAY** too much!

A grain of rice is a good amount.
Click to expand...
Is that the skinny little american rice or the good sized Thai jasmine long
grain rice??
Hard or presoaked??


regards
Freddie
 
rstlne said:
A grain of rice of AS5 probably wont be enough.. Unless your not actually
spreading it of course.. I would say that a new #2 pencil with the size of
the eraser going past the eraser holder would probably mean half of that
should be okay :P .. By the ti me you use a glove/bag/stick/CC/whatever to
spread as5 out then you'll loose half of it on the item itself..
Click to expand...

Hmm...that sounds familiar as well as accurate.
 
I'll keep you posted. (I had bought some new ram that didn't fix
the problem, so I concluded it was the mb.)

ASUS acknowledged receipt of my RMA request, but I haven't heard
anything back from them since then.

Any tips on how the RMA process is supposed to work would be
appreciated, by the way. I've never had to do it before.

Thanks,
Steve

sheer said:
LOL war over compound or pads, come on 99.9% of gamers use compound! I know
what they are trying to get rid of and it aint there cpu!

Steve let us know how you go when your new board arrives I read a similar
problem to yours which turned out to be a bank of memory on the board was
not working right which could have meant both purple and orange slots were
faulty on one side.

cheers
sheer
Click to expand...

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