Thermal compound does not get hard. It will stay sticky for years.
Maybe you are using thermal adhesive (which is an epoxy and is less
thermally conductive) instead of thermal compound.
Some do get hard(er).
Elevated temps and thermal cycling will separate the liquid
portion and smaller islands of solids are left behind. I've
noticed it on several different compounds on small-core CPU like
Celeron/P3 and Athlon/Duron. Typicially it happens with the
silicone based compounds much moreso than the synthetics like
AS3/Alumina/Ceramique/et al, if the synthetics are affected at
all.
For smaller exposed core CPU that runs pretty hot it may be
beneficial to reapply compound every 12 months or so. Same
compound "could" go longer with only a few degrees difference
though so it also depends on how concerned the user is with the
result of a few degree temp rise. Beneficial <> necessary