Q:dead laptop motherboard, could the reason be...

  • Thread starter Thread starter sitotisak
  • Start date Start date
S

sitotisak

After moving cooler off the processor than i realized that on the
cooler side there is an Aluminium foil wich is meant to shield the
processor paste. So definitely some guy haven't realized that, that
the foil has been put there to be removed later when the processor is
being installed. So could that foil which was forgotten to be removed,
could it done any harm to processor over the one year period of
working, when now the motheraboard is dead after year of working.



johnny morgan
 
After moving cooler off the processor than i realized that on the
cooler side there is an Aluminium foil wich is meant to shield the
processor paste.

Be careful!
If it looks like aluminium foil it might be something like
http://www.coollaboratory.com/en/products/liquid-metalpad/
That's not a foil to protect grease but a product intended to
maximize heath transfer, without grease.
So definitely some guy haven't realized that, that
the foil has been put there to be removed later when the processor is
being installed. So could that foil which was forgotten to be removed,
could it done any harm to processor over the one year period of
working, when now the motheraboard is dead after year of working.

If the CPU has been working for a year, don't expect some
protection foil to be the cause of failure.
If there was a forgotten protection foil, the CPU would have
failed in hours or even less, not after a year.
 
sitotisak ha scritto:
After moving cooler off the processor than i realized that on the
cooler side there is an Aluminium foil wich is meant to shield the
processor paste. So definitely some guy haven't realized that, that
the foil has been put there to be removed later when the processor is
being installed. So could that foil which was forgotten to be removed,
could it done any harm to processor over the one year period of
working, when now the motheraboard is dead after year of working.

Wrong.
1) That foil is present in every laptop's heatsink.
2) CPU are very strong components. It's quite difficult the cause is in it.

What model of laptop do you have?
 
sitotisak ha scritto:

Wrong.
1) That foil is present in every laptop's heatsink.
2) CPU are very strong components. It's quite difficult the cause is in it.

What model of laptop do you have?

And do you have any idea how hot the cpu got? Was there smoke coming
out of it?
 
And do you have any idea how hot the cpu got?  Was there smoke coming
out of it?


N-o, i just got the broken laptop, notebook.
Shit, crap...when you remove the foil the paste is under in it's
unused form, the form of paste is as such as you recieve it with new
intel boxed heatsink. HEy GUYS, i'm working with laptops so i do know
a few things so far i learned to differentiate the foil and the paste
which is not used. So this frigginn paste was intended to be used.

I'm more into story that 5%-10% off laptops received was in this
state.

i personally believe it has something to do with it.

processor is healthy. the reason of motherboard fail-up could be 0
ZERO, NO, NONE of heat dipassation.
Maybe or only a very little heat dipassation due to holes and the
ventilator work. ofcourse, it depends to the adjustment settings of
the ventilator...

i doubt fellow had a clue about adjustment!
 
And do you have any idea how hot the cpu got?  Was there smoke coming
out of it?


N-o, i just got the broken laptop, notebook.
S...t, clap ...when you remove the foil the paste is under in it's
unused form, the form of paste is as such as you recieve it with new
intel boxed heatsink. HEy GUYS, i'm working with laptops so i do know
a few things so far i learned to differentiate the foil and the paste
which is not used. So this frigginn paste was intended to be used.

I'm more into story that 5%-10% off laptops received was in this
state.


i personally believe it has something to do with it.


processor is healthy. the reason of motherboard fail-up could be 0
ZERO, NO, NONE of heat dipassation.
Maybe or only a very little heat dipassation due to holes and the
ventilator work. ofcourse, it depends to the adjustment settings of
the ventilator...


i doubt fellow had a clue about adjustment!
 
sitotisak said:
N-o, i just got the broken laptop, notebook.
S...t, clap ...when you remove the foil the paste is under in it's
unused form, the form of paste is as such as you recieve it with new
intel boxed heatsink. HEy GUYS, i'm working with laptops so i do know
a few things so far i learned to differentiate the foil and the paste
which is not used. So this frigginn paste was intended to be used.

I'm more into story that 5%-10% off laptops received was in this
state.


i personally believe it has something to do with it.


processor is healthy. the reason of motherboard fail-up could be 0
ZERO, NO, NONE of heat dipassation.
Maybe or only a very little heat dipassation due to holes and the
ventilator work. ofcourse, it depends to the adjustment settings of
the ventilator...


i doubt fellow had a clue about adjustment!

Processors are protected by THERMTRIP. If you drive up the
CPU temperature high enough, the CPU will turn off the power
instantly. A signal on the CPU, indicates when the CPU is too
hot, and that signal (THERMTRIP) is tied into the power controls.
So the processor is protected against transient high temperature
events.

Thermal interface materials, are available in pads or films. According
to this, when a foil backing is used, that is so you can separate
the item from the TIM ("clean break"). This particular product is
a phase change type, where the material flows above 65C.

http://www.chomerics.com/news/news_5_11_04.htm

http://vendor.parker.com/Groups/Sea...9004e72c7/$FILE/Phase_Change_Excerpt-5-08.pdf

Another example here. On T558, you leave the foil in place,
as it is both a heat transfer agent, and also allows the
item above it to be removed, without contaminating the phase
change material below it.

http://gamerscoreblog.com/team/archive/2006/03/10/533618.aspx

Paul
 
Processors are protected by THERMTRIP. If you drive up the
CPU temperature high enough, the CPU will turn off the power
instantly. A signal on the CPU, indicates when the CPU is too
hot, and that signal (THERMTRIP) is tied into the power controls.
So the processor is protected against transient high temperature
events.

Thermal interface materials, are available in pads or films. According
to this, when a foil backing is used, that is so you can separate
the item from the TIM ("clean break"). This particular product is
a phase change type, where the material flows above 65C.

http://www.chomerics.com/news/news_5_11_04.htm

http://vendor.parker.com/Groups/Seal/Divisions/Chomerics/Chomerics ...

Another example here. On T558, you leave the foil in place,
as it is both a heat transfer agent, and also allows the
item above it to be removed, without contaminating the phase
change material below it.

http://gamerscoreblog.com/team/archive/2006/03/10/533618.aspx

    Paul- Sakrij citirani tekst -

- Prika¾i citirani tekst -

ouki-douki!
 
Back
Top