G
George Macdonald
This article
http://www.reed-electronics.com/electronicnews/article/CA6302506.html is
also interesting because it's about copper bump posts used in the
connection of die to substrate -- seems to help with RoHS regs -- but....
looks like maybe Presler et.al. is the "real" 65nm from Intel.... at least
according to Chipworks. OTOH the results from some benchmarks are kinda
disappointing: http://www.pcworld.com/reviews/article/0,aid,124308,00.asp -
"it paled in comparison to the new FX-60-based machines".
http://www.reed-electronics.com/electronicnews/article/CA6302506.html is
also interesting because it's about copper bump posts used in the
connection of die to substrate -- seems to help with RoHS regs -- but....
looks like maybe Presler et.al. is the "real" 65nm from Intel.... at least
according to Chipworks. OTOH the results from some benchmarks are kinda
disappointing: http://www.pcworld.com/reviews/article/0,aid,124308,00.asp -
"it paled in comparison to the new FX-60-based machines".