C
Colin D
I have just bought an Asus P4C800-E motherboard and an Intel Northwood
3.0 GHz cpu with its heat sink (retail package). On fitting the cpu to
the motherboard, the chip dropped in perfectly to its ZIF socket, and
the lever closed properly.
However, when I came to fit the heatsink and fan unit, the corner clips
snapped into the mating slots in the plastic mounting screwed to the
m'board satisfactorily, but when I closed the cam levers to tighten the
HS against the chip, I was concerned at the apparently excessive
pressure applied to the assembly, enough to physically flex the m'board
and cause the plastic strengthening pad under the board to bulge. The
m'board is not as yet mounted into the case, so I am able to see the
extent of the bend in the board.
As far as I can see, the HS fitting is more or less idiot-proof, but
maybe I am missing something here. Can anyone confirm that that much
pressure is normal and ok, or not? I have relaxed the pressure till I
find out a bit more.
Thanks for any insight,
Colin.
3.0 GHz cpu with its heat sink (retail package). On fitting the cpu to
the motherboard, the chip dropped in perfectly to its ZIF socket, and
the lever closed properly.
However, when I came to fit the heatsink and fan unit, the corner clips
snapped into the mating slots in the plastic mounting screwed to the
m'board satisfactorily, but when I closed the cam levers to tighten the
HS against the chip, I was concerned at the apparently excessive
pressure applied to the assembly, enough to physically flex the m'board
and cause the plastic strengthening pad under the board to bulge. The
m'board is not as yet mounted into the case, so I am able to see the
extent of the bend in the board.
As far as I can see, the HS fitting is more or less idiot-proof, but
maybe I am missing something here. Can anyone confirm that that much
pressure is normal and ok, or not? I have relaxed the pressure till I
find out a bit more.
Thanks for any insight,
Colin.