"James Bald" said:
Paul wrote in message ...
Ah, finally.
Even on my older system I could never get Turbo to work and from the manual
thought this was only some sort of burn-in setup. Made me feel 'cheap'.
No longer.
How's your P4C800 doing Paul that Zalman sink so far ?
One thing I noticed about the Zalman's desing is de 'full copper' build.
and perpendicular fins to the propeller. IMHO, full Cu is bound to
hold-up much more heat than copper+Al fins. Copper over time is subject
to oxydation; Over a number of years, My guess would be that CuO2
layer would cripple the performance over time. Just my guess. While Al
oxide is a much better to heat transfer. My big gripe with Copper is
that Heat tends to STICK to its much higher density than to aluminum...
Hence the widespread use of Al for Heat-sink...nononsense. I tend to
faver Copper core with Al fins a lot more as a reasonnable Cu core
will pull the heat from a device quicker than AL, while Al will
dissipate it so much better from its low density and rather good
heat conductivity.
One of the reasons I bought the AlCu, is no review mentioned whether
the all copper one had a protective coating on the fins or not. I've
seen some copper products coated with what looked like lacquer, and
that cannot be good for performance. Yet, without it, the shiny
finish won't last long. A nickel plate might help, but very few
products do that.
Then again.. I just poked the WWW and found-out that I must have
seen an older Zalman full copper desing cuz this one is really
sweet looking.
http://www.techzonez.com/forums/showthread.php?p=56862#post56862
While we could learn from the AMD era and check that a full copper
solution is good if the air-flow is close to mad using rather thin
fins.....
http://www.techzonez.com/forums/showthread.php?p=56862#post56862
Zalman's use of copper an Al should combine very well indeed.
Yet, the airflow could be much improved if it was not so 'odd'.
IMHO.. fins should by bent more perpendicular to propeller surface
to increase GREATLY the fow.
That is a fine observation and something I didn't really think
about too much (because reviews stated the measured noise was
low, I didn't worry about it). So far, I'm really puzzled
by the whole thing, because the fan doesn't really _blow_ the
air. What seems to happen, is there is a warm cloud around the
area outside the heatsink, and yet you don't really feel a well
defined air flow through it. My old heat sink, when you put a hand
near it, you can feel an air flow, and with that flow, you can
imagine the possibility of the CPU fan being used to cool an
adjacent Northbridge for example. I cannot see that happening
with the Zalman, as there is just a cloud of warm air around it.
Even in the Antec Sonata case, with the 120mm fan on the rear
of the case running, and the side off the case, I can still feel
that cloud of warm air. So, I guess my understanding of how it
works will have to change - initially, I thought it was the
large size and the surface area that gave it good cooling properties,
while the large aperture between fins keeps it quiet. Instead,
I think it is relying on turbulence amongst the fins, to transfer
heat from the fin into the air. Thus, bending the fins to reduce
turbulence would ruin it, if that is how it really works. It is the
strangest HSF I've played with. And, I haven't even bothered
to install MBM5 or take any readings yet
One of the downsides of the Zalman, is it is exposed while you work
inside the case, and cables like to snag on it. I like to install
the HSF before putting the motherboard in the case, so I can carefully
inspect the fit. Maybe with this one, it would be better to install
it last.
The other reason I bought the AlCu, is it is lighter than the Cu
one. There are two versions - the 7000 is the original, and the
7000A contains a few extra parts for mounting os S478, S462, and
Athlon64.
Here is the older version I saw..
http://www.casecooler.com/zacnpe4hesi.html I think this is a waste...
While Full Cu is easier to manufacture.
If you talk to a machinist, you'll find out that copper is hated
as a material. Copper doesn't cut when you machine it, it smears.
I worked with an Italian machinist, a great guy, and if you say
the word copper, he switches to Italian momentarily, to find some
choice words to say
Yet I'm not even sure the later AL-Cu version is better than a
thick Intel original P4 HS design.. The airflow is much more steady,
and AL dissipate plenty fast enough... Best MOD I would think is
to better the junction between CPU and HS...
I've been there pal.. Al is still the best way to get rid of heat...
Copper holds to it ! A well designed combo is pinnacle....
Otherwise Full Aluminum does miracle !
Copper is good for solving the "spreading angle" problem. If you
want to cool an Athlon, which doesn't have its own heat spreader,
then a copper core heatsink makes sure the heat gets spread to the
outer fins, instead of just the fins in the center. In my opinion,
that is what the copper is best at, and then the only thing the
machinist has to do, is lap the surface to make it smooth.
Here is a mad desing that works.
http://www.viperlair.com/reviews/case_cool/coolermaster/hsf/hyper6/index.shtml
Check-out what Zalman does for hot Nvidia GPUs.. LOL
http://www.silentpcreview.com/modul...ns&file=index&req=viewarticle&artid=65&page=1
Then I read that the ATI rad 9800 HS were designed by Zalman too.
I had not idea.
Cool ways to cool a Radeon 9800Pro..
http://forums.sudhian.com/messageview.cfm?catid=74&threadid=56234
Yet Saphire model uses ZM80.
*** A solution for everything: *** (Except price)
http://www4.tomshardware.com/howto/20040115/index.html
http://test.zalman.co.kr/english/product/TNN500A.htm
Forgive me.. I build puters, but also make my own wine and this
batch is Excellent; So is my new ASUS board.
.. Is this topic
HOT or what ! Don't flame me for the OT content.
Good night !
http://www.aavidthermalloy.com/technical/papers/aircooled.shtml
Some of those designs use heatpipes, and that is another strange
technology. The first heatpipes I saw, were simple copper
pipes, with a liquid sealed inside at one atmosphere. The liquid
would boil at the normal temp (say 67C for ethanol?). Now, to
me, this implies a non-linear response - the boiling/condensation
cycle only really runs when the thing hits 67C, and you would
think there is a potential for catastrophy if the thing gets
too much heat flux pushed through it. The thermal guys I've talked
to, say they have an extremely low thermal resistance, but I'm
not sure the ones we are seeing in computer products are that
effective.
The ones in these products use a copper pipe, but there is a
material inside the pipe with a large surface area. This forms
a capilliary surface, and allows vapor to flow no matter what
physical orientation the heat pipe is in. (May not be true of
ZM80). The fluid in some of them apparently, is not at 1 ATM,
but is under reduced pressure (partial vacuum), which causes
boiling point depression. That way, they can pick any boiling
point they want, when it is designed.
In one review I read, the reviewer cut the copper pipes as
part of his testing. He found very little "juice" inside,
and the most embarrassing part, was the cooling performance
of the product hardly changed at all. So, when I see heat pipes
on products now, I tend to be a little more sceptical of the
whole thing.
You wouldn't think there would be that much money in
making designer heatsinks, but there seems to still be
a good deal of activity.
Paul
