Keith said:
As noted below in my first post, there are several ways to do this,
sharing substrate or not, sharing some level of cache, the differences
being in how well some subset of applications runs due to the choice. At
the end user level I think it just boils down to two CPU operation from
one package, the details are not part of the buying choice, not do they
need to be.
One chip is not "slapped together", in as much as "two chips on a
single carrier" is.
As opposed to slapped together at the mask. I take your point, but I'm
still lacking a great argument that one method is better than the other.
Both matching chip speed before bonding the the substrate and cache
sharing have been mentioned, the problem is that they're exclusive
advantages. And no one has shipped a chip with bonded multi-core and a
separate cache, L2 or L3, also bonded. Intel did CPU and cache as two
bonded chips, so there's some prior art.
Is there really a motherboard vendor who has shipped a dual-core BIOS
fix for a board designed and sold for single core operation?
I'm told that a dual core Intel EE chip can be dropped into a recent HT
aware motherboard and that the voltages are compatible. Since I can't
get a BIOS which will work, I'm not motivated to investigate.
The question was serious, why would anyone buy a Xeon at this point?