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About one and a half years ago, Intel released LGA 1156, and plus three chipset P55/H55/H57.
As to CPU, main products are Core i3/i5/i7, and their obvious features are:
dual-core with built-in GPU, quad-core with built-in HT, and quad-core without built-in HT respectively.
As mentioned before, the primary goal of LGA 1156 platform is to replace Intel high-intermediate-level products;
besides, LGA 1366 is still the predominant platform for the high-level ones.
The product positioning of the new LGA 1155 is similar to that of LGA 1156.
To most users, they probably feel that the replacing is too fast. When facing three kinds of LGA platform, they even feel perplexed.
If future price of LGA 1156 can be lowered appropriately,
it is also a good trend that the platform becomes the mainstream for low-intermediate-level products.
At the beginning of 2010, Intel introduced 32nm CPU, and the related products are:
dual-core—LGA 1156 i3 and i5; six-core—LGA 1366 i7 980X Extreme, representing low and high-level CPU respectively.
As for 32nm quad-core processor, Sandy Bridge LGA 1155 will be released in 2011.
This article will introduce the latest LGA 1155 platform, and analyse important features about 32nm Sandy Bridge CPU.
As for the CPU, it is Intel Core i7-2600K, and “K” means that CPU multiplier can be unlocked.
The clock is 3.4GHz (maximum: 3.80GHz), and Turbo Boost 2.0 technology is supported.
There are 4 Cores and Hyper-Threading technology, so 8 Threading is supported, also abbreviated as 4C/8T.
And, the CPU uses 32 nm manufacturing process, with 95W and 8MB L3 Cache, is the highest-level specification amongst current LGA 1155.
Back side of 2600K D1 and 2400 D2:
The motherboard is BIOSTAR TSERIES TP67XE, and this brand’s products are famous for parity and overclocking.
The colour of the package is different; this time red makes the looking of the motherboard more distinguishing feature.
Accessories:
User’s Manual, Rear I/O Panel for ATX Case, Serial ATA Cable, CorssFire/SLI Bridge, Fully Setup Driver CD.
As for colour matching, PCB is black, and PCI-E or DIMM are matched red or white; the whole appearance looks not bad.
Red matching is an eye-catching design.
More and more electronic products are matched red and black,
the colour combination (similar to the colour used in automobile racing) that stresses speed or high performance.
Lower-left of the motherboard:
2 X PCI-E 2.0 X16: support 2Way CrossFireX and SLI technology, with bandwidth X8+X8
2 X PCI-E X1
2 X PCI
LAN chipset: Realtek RTL8111DL
Codec: Realtek ALC892, with 8+2 channels and supporting Blu-ray Codec technology
Lower-right of the motherboard:
3 X red SATAII: provided by P67 chipset, support RAID 0, RAID 1, RAID 5, and RAID 10
2 X white SATAIII: provided by P67 chipset, support RAID 0, RAID 1, RAID 5, and RAID 10
Power button, reset button, and debug indicators
Upper-right of the motherboard:
4 X DIMM DDR3, supporting 1066/1333/1600/1866/2133, maximum capacity of DDR3 is 16GB. Only by overclocking can DDR3 2133 above be achieved.
1 X IDE, 24-pin power connector
As to CPU, main products are Core i3/i5/i7, and their obvious features are:
dual-core with built-in GPU, quad-core with built-in HT, and quad-core without built-in HT respectively.
As mentioned before, the primary goal of LGA 1156 platform is to replace Intel high-intermediate-level products;
besides, LGA 1366 is still the predominant platform for the high-level ones.
The product positioning of the new LGA 1155 is similar to that of LGA 1156.
To most users, they probably feel that the replacing is too fast. When facing three kinds of LGA platform, they even feel perplexed.
If future price of LGA 1156 can be lowered appropriately,
it is also a good trend that the platform becomes the mainstream for low-intermediate-level products.
At the beginning of 2010, Intel introduced 32nm CPU, and the related products are:
dual-core—LGA 1156 i3 and i5; six-core—LGA 1366 i7 980X Extreme, representing low and high-level CPU respectively.
As for 32nm quad-core processor, Sandy Bridge LGA 1155 will be released in 2011.
This article will introduce the latest LGA 1155 platform, and analyse important features about 32nm Sandy Bridge CPU.
As for the CPU, it is Intel Core i7-2600K, and “K” means that CPU multiplier can be unlocked.
The clock is 3.4GHz (maximum: 3.80GHz), and Turbo Boost 2.0 technology is supported.
There are 4 Cores and Hyper-Threading technology, so 8 Threading is supported, also abbreviated as 4C/8T.
And, the CPU uses 32 nm manufacturing process, with 95W and 8MB L3 Cache, is the highest-level specification amongst current LGA 1155.
Back side of 2600K D1 and 2400 D2:
The motherboard is BIOSTAR TSERIES TP67XE, and this brand’s products are famous for parity and overclocking.
The colour of the package is different; this time red makes the looking of the motherboard more distinguishing feature.
Accessories:
User’s Manual, Rear I/O Panel for ATX Case, Serial ATA Cable, CorssFire/SLI Bridge, Fully Setup Driver CD.
As for colour matching, PCB is black, and PCI-E or DIMM are matched red or white; the whole appearance looks not bad.
Red matching is an eye-catching design.
More and more electronic products are matched red and black,
the colour combination (similar to the colour used in automobile racing) that stresses speed or high performance.
Lower-left of the motherboard:
2 X PCI-E 2.0 X16: support 2Way CrossFireX and SLI technology, with bandwidth X8+X8
2 X PCI-E X1
2 X PCI
LAN chipset: Realtek RTL8111DL
Codec: Realtek ALC892, with 8+2 channels and supporting Blu-ray Codec technology
Lower-right of the motherboard:
3 X red SATAII: provided by P67 chipset, support RAID 0, RAID 1, RAID 5, and RAID 10
2 X white SATAIII: provided by P67 chipset, support RAID 0, RAID 1, RAID 5, and RAID 10
Power button, reset button, and debug indicators
Upper-right of the motherboard:
4 X DIMM DDR3, supporting 1066/1333/1600/1866/2133, maximum capacity of DDR3 is 16GB. Only by overclocking can DDR3 2133 above be achieved.
1 X IDE, 24-pin power connector