GT wrote:
I wouldn't run the mobo for long with it sitting on the foam sheet
(slab?) because of the possibility of overheating. OTOH your
suggestion of using a book or DVD/CD cases could be a lot worse
because they're made of materials that generate a lot of static
electricity (styrene or polypropylene for CD/DVD cases, vinyl or clear
Mylar for book jackets). I like John A's suggestion to install
standoffs on the motherboard to prop it up from the table.
I usually set boards on a thick magazine or three layers of
cardboard cut from a box. Well actually I always do it,
since all boards are tested before being built into a
system. Putting them on this elevated material merely
serves the purpose of getting the board off the table by a
few millimeters so the card brackets have room to hang over
the board edge.
In some cases where the heatsink is through-board mounted or
attaches to a frame behind the board, I'll put an addt'l
layer of cardboard under the bottom 2/3rd of the board so it
all sits at about the same height, so plugging or unplugging
things doesn't flex the board as the entire back is
reasonably well supported. Standoffs might work in some
situations, but I would not trust that, as pressure on the
board will make the standoff move relative to the surface of
the (table, etc), allowing the board to flex more than it
would in a case with rigidly mounted standoffs.
I've never had a board overheat like that, do not consider
airflow a factor at all, nor any other problems, but if
there were fets on the back, I agree it would be best not to
put the area in contact with any material with a lowish
melting point as even if they stayed cool enough, the
material may be degraded from the heat. It seems fets on
the back are becoming as rare as they used to be though, you
rarely see boards with that layout, configuration, and with
most now at least 3 stages, the heat density is lower.