Maybe you'll need a riser card. This doc lists some riser cards,
for turning a slot sideways.
ftp://ftp.tyan.com/matrix/matrix_riser.pdf
Now, all you need is a low profile socket 754 heatsink/fan.
And, perhaps, to unsolder the audio connector. I have a board
with a similar audio connector, and it is 1.55" off the top
of the board, and that could be a tight fit. I think I saw 1.75"
mentioned for 1U, but you'd need space for the covers etc in
that space, so it will be a close thing.
How tall are the RAM DIMMs ?
Besides, the larger volume you use for the case, the easier
it will be to cool (the fans can be a bit quieter, if they
are larger).
HTH,
Paul
Working through some dimensions,
1U is 1.75", at least that is what I see in Google.
Now, adding up the dimensions, from bottom to top of assembly -
these are estimates only:
0.040" Sheet metal cover
0.1" Clearance for component leads on underside of motherboard
There will probably be some kind of standoff on the sheet
metal cover to enforce this clearance.
0.0625" Standard 1/16" thick motherboard.
1.55" Connector for three sound jacks
0.040" Top sheet metal cover
1.79" (total)
So, the sound connector might just be a bit too tall for 1U.
In terms of cooling, there are certainly copper heatsink cooling
solutions for Xeons S603/604 in 1U configuration, but S754/940 is
quite new, and there aren't likely to be a lot of new products out
for that.
This one is 2.7" from the top of the die. A thinner fan might
help. This looks like a better fit with a 2U enclosure. Needs more
dimensional info to be absolutely sure.
http://www.swiftnets.com/products/mcx64-V.asp
This one has an even thicker base, and you buy the fan separately.
http://www.swiftnets.com/products/mcx6400-V.asp
Maybe you could use the mcx64-v and remove the fan. Then, you'll
need to examine the design of the typical 1U enclosure, to see
if there is a way to build a duct from whatever moves air through
the enclosure, around the CPU heatsink. A squirrel cage blower
is an option, instead of a standard fan, and maybe a "wind tunnel"
style cooling solution can be constructed.
The thing about aggressive packaging, is there is less room for
mistakes, and the execution has to be precise. I can promise you,
from working in rooms full of compact, high power equipment, that
the 1U solution cannot be quiet. For your own sanity, try something
larger, like a 4U, as you can use more standard solutions to get
the system working. After all, the objective is to have a working
server in a reasonable time, not to reengineer a new packaging
solution on your own.
If you were serious about building a quiet server, a better platform
would be mini-itx. While the processors are gutless (1GHz), the
thermal performance is much better. Some of those systems are powered
by an external 60W power brick, to build the basic computer. If you
have a lot of disks, that would necessitate bumping up the power
supply somewhat.
This board, for example, can use a Tualatin, and there are still
a few of those left. They draw 35W at 100% load, for the fastest
ones.
http://www.commell.com.tw/Product/SBC/LV-603.HTM
Check out the Via boards reviewed and sold from this site. They
can be housed in very small and elegant packages:
http://www.mini-itx.com/ (reviews and articles)
http://www.mini-itx.com/store/ (product for sale)
You could always save the K8V SE for a desktop upgrade for
an existing computer.
HTH,
Paul