Debug said:
I think the most improtant thing when using any thermal paste is to
use it *very* sparingly. Too much and you will do more harm than good.
This is a myth and I completely dispute it. The real danger when applying
themal paste is not applying enough. If you put too much on, it just gets
squeezed out of the way, so that only a thin layer remains between core and
heatsink.
Try it - put plenty on and then remove the heatsink. What do you see? A
*thin* film of compound on top of the CPU and on the HS where the CPU makes
contact. And a rim of compound all around the outside, where its been
squeezed out of the way.
But if you don't put enough on then you run the risk of there not being
enough to fill the grooves in the heatsink and you can have air gaps. Or
areas of the CPU that aren't even in contact with the heatsink at all!
It wasn't until I started lapping heatsinks that I could see for myself how
unlevel both the heatsink and the CPU! really are. You need to make sure
your CPU is making good contact and if you go for the "thinnest layer
possible" approach, there's no guarantee that this will be achieved.
My advice is to put *plenty* of compound on. Yes, your temps with AS3 and
AS5 *might* be a couple of degrees higher. I say "might" - I am not
convinced. And even then so what? But you will be sure that there is a
good bond between the CPU and the heatsink. Put not enough on, and you risk
temps much much higher, possible damage to your CPU and all sorts of
instability problems caused by parts of the chip overheating.
Chip.